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» Description |
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HTK-002-U1 Thermal Compound
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes highthermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, which increases the efficiency ofthe device.
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» Attributes |
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| General Information | |
| Manufacturer | Cooler Master Co., Ltd |
| Manufacturer Part Number | HTK002U1 |
| Manufacturer Website Address | www.coolermaster-usa.com |
| Brand Name | Cooler Master |
| Product Name | Thermal Compound |
| Product Type | Thermal Grease |
| Physical Characteristics | |
| Color | Gray |
| Miscellaneous | |
| Additional Information | Viscosity (@25 C): 1400 P Specific Gravity @ 25 C: 2.63 g/cm3 Bulk Thermal Conductivity: 4.5 W/m-K Thermal Impedance: ~0.02 C-in/W Volume Resistivity: 5.0 x 1015 Ohm cm Shelf Life: 24 months fro DOM Evaporation (200 C x 24hr): 0.35%
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| Warranty | |
| Limited Warranty | 1 Year |
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